Nov 12

Written by:
Saturday, November 12, 2011 

Ucamco welcomes European PCB Manufacturers to its Direct Imaging Seminars at Productronica for the European premiere of Dainippon Screen's revolutionary Ledia 5 direct imaging system. Offering unprecedented throughputs, yields and quality regardless of feature size and production volumes, the world's first multi-wavelength UV LED direct imaging solution offers astounding drop-in capabilities and maximum flexibility for fine feature imaging.

A problem with conventional laser direct imaging is that it can be relatively slow. World class electronics manufacturing equipment supplier Dainippon Screen has accordingly developed Ledia 5, a brand-new system that delivers a five-fold increase in direct imaging throughputs, thanks to a world-first high-intensity, highly flexible multi-wavelength exposure head, and newly designed autoloader and material handling solutions. 

Ledia delivers high productivity and throughput on a wide range of board formats, no matter what your volumes are, and can guarantee optimum quality on ultra-fine features down to a tiny 30 µm. All while writing directly onto conventional photoresists and solder mask- which means that Ledia 5 is a drop-in into existing production lines offering high-speed, high-yield production with minimum hassle.

Come to the seminars and find out first hand why Ledia 5 is creating so much excitement in the marketplace, and discover how much more you too can expect of your imaging processes.

The seminar is limited to European PCB Manufacturers and by advance registration only. Places are limited.