Ledia 5 - The Fastest and Most Cost-Effective Direct Imaging
Ucamco has partnered with Dainippon Screen to introduce Ledia 5,
Screen's revolutionary Direct Imaging machine to the European market.
Ledia 5 offers unparalleled benefits over traditional laser direct imaging:
- UV-LED light source with broad wavelength spectrum resulting in:
- optimal imaging of a wide range of solder mask and resist film types
- optimal curing over the whole depth of the solder mask and resist film
- Imaging of conventional solder mask film with high throughput
- Imaging of conventional resist film with high throughput
- Low operational cost
- Up to 5 times faster than current systems
Our Direct Imaging Systems are available in various resist imaging and panel size capability models to best suit our customer’s imaging production needs.
However all models share the common basic qualities:
- Straightforward and robust 'maintenance free' design
- Seamless integration with existing CAM systems
- Fully configurable = drop-in system to replace or complement existing direct imaging system
Ledia 5S-SM
Images solder mask film and resist film.
Has 5 or 6 heads to expose a panel width of up to respectively 540 mm or 610 mm
Is a manual system which can be automated with your own choice of automation
Ledia 5S-S
Images solder mask film and resist film.
Has 5 or 6 heads to expose a panel width of up to respectively 540 mm or 610 mm
Has an integrated automatic loading and unloading system
Ledia 5S-PM
Images resist film.
Has 5 or 6 heads to expose a panel width of up to respectively 540 mm or 610 mm
Is a manual system which can be automated with your own choice of automation
Ledia 5S-P
Images resist film.
Has 5 or 6 heads to expose a panel width of up to respectively 540 mm or 610 mm
Has an integrated automatic loading and unloading system
