Hi-Q has invested in a Ledia SD-53 from Ucamco. Selected primarily for its precision, front-to-back registration reliability and its unbeatable soldermask capabilities, this 5-head 3-wavelength system will be used to image inner- and outer-layer dry films and soldermasks.
With Ledia, Hi-Q knows it can guarantee its clients even better service, perfect quality features with virtually no undercut, and robust, stable soldermask dams even on its finest sub-50 µm HDI boards.
Automated data entry and design analysis
- Ucamco’s 9th Generation Sales & Engineering Tool
- Field proven with more than 250 installations
in daily production
- Seamless integration into any environment