Hi-Q has invested in a Ledia SD-53 from Ucamco. Selected primarily for its precision, front-to-back registration reliability and its unbeatable soldermask capabilities, this 5-head 3-wavelength system will be used to image inner- and outer-layer dry films and soldermasks.
With Ledia, Hi-Q knows it can guarantee its clients even better service, perfect quality features with virtually no undercut, and robust, stable soldermask dams even on its finest sub-50 µm HDI boards.
Hi-Q's decision to purchase its Ledia system followed careful benchmarking tests, during which Ledia's performance put it head and shoulders above the rest. The results were impressive, but before investing in its future, Hi-Q decided to ask a real expert, a leading European PCB manufacturer and Ledia owner, how the technology stacks up in real life. In open, honest discussions with the shop-floor operators who know Ledia best, Hi-Q got the confirmation it needed that Ledia is simply the best direct imaging technology on the market in terms of real-time reliability, repeatability and production quality, but also for its throughput speed, unsurpassed uptime, and low operation costs
ELVIA, the largest French PCB Manufacturing Group , invested in a second Ledia direct imager, for inner, outer and soldermask production in the Coutances plant. After surveying the market it became clear the Ledia 3-wavelength optics allows ELVIA to offer unsurpassed quality, especially for soldermask. It supports the groups’ strategic objective to offer a unique “one stop shop” PCB solution with all technologies and services available.
Teledyne Labtech purchases Ledia SB32 Direct Imager
Teledyne Labtech, a UK based PCB manufacturer specialised in the manufacturing of a wide range of high performance RF/Microwave PCBs, utilising a variety of complex technologies and a wide range of materials, confirm delivery and commissioning of a Ledia SB32 Direct Imaging system.
John Priday (CTO) commented: “The Ledia Direct Imaging system is ideally suited for a company of our size and will greatly enhance our manufacturing capabilities ...
Ucamco announces new Ledia models with 3 wave lengths
Ledia – optimising the light fantastic
September 25th 2015 - Ucamco is delighted to announce the new 3 Wavelength series of Ledia Direct Imaging (DI) systems for the accurate, high-speed exposure of the industry's most demanding soldermask, inner-layer and outer-layer resists.
When it comes to the direct imaging of PCB materials, Dai Nippon Screen's Ledia multi-wavelength UV LED DI platform has always led the field. First, with its 2 Wavelength Ledia imaging systems, Screen delivered unprecedented DI throughputs on even the most demanding inner- and outer-layer resists, and it gave PCB manufacturers the very first DI technology with which to process standard soldermask resists accurately and at production speeds.
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