LeVina: Direct Imaging for next-gen packaging substrates
Ucamco is proud to introduce LeVina to the European market. LeVina is the perfect Direct Imaging solution for next-gen packaging substrates.
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News
CIPSA Circuits delighted with Ledia direct imager and autoloader
In January of 2021, Barcelona based CIPSA Circuits installed a Ledia direct imager from Ucamco along with an autoloader from Techno System - Benmayor. The early results are very satisfactory, much to the delight of Nuria Vidal, General Manager at CIPSA.
Read moreException PCB purchases Ledia Direct Imager
Exception PCB, one of the largest dedicated time and technology PCB manufacturers in the UK, has purchased a Ledia Direct Imager from Ucamco. To great satisfaction of all parties involved.
Read moreEurocircuits Hungary purchases third Ledia Direct Imager
Eurocircuits has purchased their third Ledia Direct Imager from Ucamco for their Hungary site.
Read moreProtecno goes for Ledia Direct Imager
Protecno, member of the GTID Group, has purchased a Ledia Direct Imager for its PCB manufacturing plant in Brest, France.
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